Technically you could also lay out new components and copper trace on an actual brick, too.
I've always understood it to mean 'broken beyond software or high-level firmware repair'. i.e. if not actually a blown component, something needs to be reflashed which has an inaccessible JTAG header or something, rather than something 'higher level' like recovery images over ADB & USB.
I've always understood it to mean 'broken beyond software or high-level firmware repair'. i.e. if not actually a blown component, something needs to be reflashed which has an inaccessible JTAG header or something, rather than something 'higher level' like recovery images over ADB & USB.