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One is often able to inspect beyond that level.

https://duckduckgo.com/?q=semiconductor+decapsulation

The fact that these techniques do work fairly well for semiconductor reverse engineering is a reason that recent research on "stealthy dopant-level hardware Trojans" was scary.

http://www.iacr.org/workshops/ches/ches2013/presentations/CH...

Though maybe that's what your reference to the inability to "seriously" inspect chips refers to. :-)

This research produces optically indistinguishable ICs with different electrical properties, which hinders optical reverse engineering.

My impression is that there's still a semiconductor device reverse engineering technique which likely defeats this measure (FIB imaging)

https://en.wikipedia.org/wiki/Focused_ion_beam

as well as some other microscopy techniques that might conceivably detect these differences, but that it's more difficult and expensive overall compared to optical imaging.



I just saw on the cryptography mailing list that some researchers have succeeded in using both SEM and FIB to see the stealthy dopants:

https://eprint.iacr.org/2014/508

So maybe the dopants have to get even stealthier if they're to avoid expert semiconductor reverse engineers. :-)




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